Intel LGA1156&2011 Series

• DIMENSIONS: 90(L)*90(W)*64mm(H)
• MATEAIL:AL FIN+AL Base+HP3
• PROCESS: Stamping FIN+AL base +HP Soldering
• CPU SIZE: 80*80mm
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.6mm
• POWER DISSIPATION: 85 W
• DIMENSIONS: 90(L)*90(W)*64mm(H)
• MATEAIL:AL FIN+AL Base+HP3
• PROCESS: Stamping FIN+AL base +HP Soldering
• CPU SIZE: 80*80mm
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.6mm
• POWER DISSIPATION: 85 W