Intel LGA1156&2011 Series

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• DIMENSIONS: 106.5(L)*80(W)*27mm(H)
• MATEAIL:AL FIN+AL Base
• PROCESS: Stamping FIN+AL base Soldering+FAN Assembly
• CPU SIZE: 56*94mm
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.6mm
• POWER DISSIPATION: 95W
• DIMENSIONS: 106.5(L)*80(W)*27mm(H)
• MATEAIL:AL FIN+AL Base
• PROCESS: Stamping FIN+AL base Soldering+FAN Assembly
• CPU SIZE: 56*94mm
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.6mm
• POWER DISSIPATION: 95W