AMD SP3 Series

• DIMENSIONS: 118(L)*92.4(W)*64.5mm(H)
• MATEAIL:Aluminum FIN + Copper Base+6HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 2.0mm
• POWER DISSIPATION: 350W
• DIMENSIONS: 118(L)*92.4(W)*64.5mm(H)
• MATEAIL:Aluminum FIN + Copper Base+6HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 2.0mm
• POWER DISSIPATION: 350W