AMD SP3 Series

• DIMENSIONS: 118(L)*92.4(W)*25.0mm(H)
• MATEAIL:Aluminum FIN + Copper Base+4HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.65mm
• POWER DISSIPATION: 260W
• DIMENSIONS: 118(L)*92.4(W)*25.0mm(H)
• MATEAIL:Aluminum FIN + Copper Base+4HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.65mm
• POWER DISSIPATION: 260W