AMD SP3 Series

• DIMENSIONS: 115(L)*78.0(W)*64.0mm(H)
• MATEAIL:Aluminum FIN + Copper Base+4HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 1.90mm
• POWER DISSIPATION: 300W
• DIMENSIONS: 115(L)*78.0(W)*64.0mm(H)
• MATEAIL:Aluminum FIN + Copper Base+4HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 1.90mm
• POWER DISSIPATION: 300W