AMD SP3 Series

• DIMENSIONS: 120(L)*80(W)*24.5mm(H)
• MATEAIL:Aluminum FIN + VC
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.5mm
• POWER DISSIPATION: 230W
• DIMENSIONS: 120(L)*80(W)*24.5mm(H)
• MATEAIL:Aluminum FIN + VC
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.5mm
• POWER DISSIPATION: 230W