服務器散熱模組Server Cooling Modules
Intel LGA4677 SeriesIntel LGA4677 Series
113(L)*78(W)*19.1mm(H)
← 同分類：服務器散熱模組← Category: Server Cooling Modules尺寸Dimensions
113(L)*78(W)*19.1mm(H)
材質Material
Copper FIN + Copper Base
製程Process
Skived FIN+Soldering+Assembly
鰭片厚度Fin thickness
0.15mm
鰭片間距Fin pitch
0.15mm
散熱功率Power dissipation
400W
完整規格Full specifications
規格與尺寸Specifications & dimensions
• DIMENSIONS: 113(L)*78(W)*19.1mm(H)
• MATEAIL：Copper FIN + Copper Base
• PROCESS: Skived FIN+Soldering+Assembly
• FIN THICKNESS: 0.15mm
• FIN PITCH: 0.15mm
• POWER DISSIPATION: 400W
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