服務器散熱模組Server Cooling Modules
Intel LGA3647 SeriesIntel LGA3647 Series
108(L)*78(W)*64.5mm(H)
← 同分類：服務器散熱模組← Category: Server Cooling Modules尺寸Dimensions
108(L)*78(W)*64.5mm(H)
材質Material
Aluminum FIN + Copper Base+3HP
製程Process
Stamping+Soldering+FAN Assembly
風扇尺寸Fan size
DC6025 FAN
風扇轉速Fan speed
1600~6800RPM
散熱功率Power dissipation
205W
完整規格Full specifications
規格與尺寸Specifications & dimensions
• DIMENSIONS: 108(L)*78(W)*64.5mm(H)
• MATEAIL：Aluminum FIN + Copper Base+3HP
• PROCESS: Stamping+Soldering+FAN Assembly
• FAN SIZE: DC6025 FAN
• FAN SPEED: 1600~6800RPM
• POWER DISSIPATION: 205W
同分類產品More in this category
服務器散熱模組Server Cooling Modules
Intel LGA4677 SeriesIntel LGA4677 Series
113(L)*78(W)*64.5mm(H)
查看規格 →View specs →
Intel LGA4189 SeriesIntel LGA4189 Series
113(L)*78(W)*155.0mm(H)
查看規格 →View specs →
Intel LGA4189 SeriesIntel LGA4189 Series
113(L)*78(W)*28.0mm(H)
查看規格 →View specs →
Intel LGA4677 SeriesIntel LGA4677 Series
113(L)*78(W)*125.5mm(H)
查看規格 →View specs →
把規格給我們Send us your specs
提供功耗、空間限制與工作環境，工程團隊會回覆可量產的方案與報價。Tell us the power dissipation, space constraints and operating environment — our engineers will reply with a production-ready solution and quotation.