服務器散熱模組Server Cooling Modules
Intel LGA3647 SeriesIntel LGA3647 Series
108(L)*78(W)*25.5mm(H)
← 同分類：服務器散熱模組← Category: Server Cooling Modules尺寸Dimensions
108(L)*78(W)*25.5mm(H)
材質Material
Aluminum FIN
製程Process
Extrusion CNC+Assembly
鰭片厚度Fin thickness
0.8mm
散熱功率Power dissipation
75W
完整規格Full specifications
規格與尺寸Specifications & dimensions
• DIMENSIONS: 108(L)*78(W)*25.5mm(H)
• MATEAIL：Aluminum FIN
• PROCESS: Extrusion CNC+Assembly
• FIN THICKNESS: 0.8mm
• FFIN PITCH: 3.3mm
• POWER DISSIPATION: 75W
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