服務器散熱模組Server Cooling Modules
Intel LGA3647 SeriesIntel LGA3647 Series
108(L)*78(W)*25.5mm(H)
← 同分類：服務器散熱模組← Category: Server Cooling Modules尺寸Dimensions
108(L)*78(W)*25.5mm(H)
材質Material
Aluminum FIN + Copper Base+3HP
製程Process
Stamping+Soldering+Assembly
鰭片厚度Fin thickness
0.3mm
鰭片間距Fin pitch
1.6mm
散熱功率Power dissipation
165W
完整規格Full specifications
規格與尺寸Specifications & dimensions
• DIMENSIONS: 108(L)*78(W)*25.5mm(H)
• MATEAIL：Aluminum FIN + Copper Base+3HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.6mm
• POWER DISSIPATION: 165W
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