服務器散熱模組Server Cooling Modules
Intel LGA1700 SeriesIntel LGA1700 Series
92(L)*90(W)*55.7mm(H)
← 同分類：服務器散熱模組← Category: Server Cooling Modules尺寸Dimensions
92(L)*90(W)*55.7mm(H)
CPU 鎖孔間距CPU hole space
78*78mm
材質Material
Copper FIN + Copper Base
製程Process
Skived FIN+ FAN Assembly
風扇尺寸Fan size
DC 8025 FAN
風扇轉速Fan speed
1700~4300RPM
散熱功率Power dissipation
110W
完整規格Full specifications
規格與尺寸Specifications & dimensions
• DIMENSIONS: 92(L)*90(W)*55.7mm(H)
• CPU HOLE SPACE: 78*78mm
• MATEAIL：Copper FIN + Copper Base
• PROCESS: Skived FIN+ FAN Assembly
• FAN SIZE: DC 8025 FAN
• FAN SPEED: 1700~4300RPM
• POWER DISSIPATION: 110W
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