Intel LGA3647 Series
108(L)*78(W)*64.0mm(H)
價格請洽詢
• DIMENSIONS: 108(L)*78(W)*64.0mm(H)
• MATEAIL：Aluminum FIN + Copper Base+4HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 2.04mm
• POWER DISSIPATION: 205W
核心規格
尺寸
108(L)*78(W)*64.0mm(H)
材質
Aluminum FIN + Copper Base+4HP
散熱功率
205W
製程
Stamping+Soldering+Assembly
鰭片厚度
0.4mm
鰭片間距
2.04mm