Intel LGA3647 Series
91(L)*88(W)*25.5mm(H)
價格請洽詢
• DIMENSIONS: 91(L)*88(W)*25.5mm(H)
• MATEAIL：Aluminum FIN + Copper Base+3HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.75mm
• POWER DISSIPATION: 165W
核心規格
尺寸
91(L)*88(W)*25.5mm(H)
材質
Aluminum FIN + Copper Base+3HP
散熱功率
165W
製程
Stamping+Soldering+Assembly
鰭片厚度
0.3mm
鰭片間距
1.75mm