Intel LGA1700 Series
90(L)*90(W)*65.0mm(H)
價格請洽詢
• DIMENSIONS: 90(L)*90(W)*65.0mm(H)
• CPU HOLE SPACE: 78*78mm
• MATEAIL：Aluminum FIN + Copper VC+3HP
• PROCESS: Stamping FIN+VC soldering Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 2.0mm
• POWER DISSIPATION: 230W
核心規格
尺寸
90(L)*90(W)*65.0mm(H)
材質
Aluminum FIN + Copper VC+3HP
散熱功率
230W
製程
Stamping FIN+VC soldering Assembly
鰭片厚度
0.4mm
鰭片間距
2.0mm
CPU 鎖孔間距
78*78mm