Intel LGA1700 Series
94(L)*94(W)*125mm(H)
價格請洽詢
• DIMENSIONS: 94(L)*94(W)*125mm(H)
• CPU HOLE SPACE: 78*78mm
• MATEAIL：Aluminum FIN + Copper Base+6HP
• PROCESS: Stamping FIN+HP Riveting Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 2.0mm
• POWER DISSIPATION: 280W
核心規格
尺寸
94(L)*94(W)*125mm(H)
材質
Aluminum FIN + Copper Base+6HP
散熱功率
280W
製程
Stamping FIN+HP Riveting Assembly
鰭片厚度
0.4mm
鰭片間距
2.0mm
CPU 鎖孔間距
78*78mm