Intel LGA1700 Series
88(L)*88(W)*25.0mm(H)
價格請洽詢
• DIMENSIONS: 88(L)*88(W)*25.0mm(H)
• CPU HOLE SPACE: 78*78mm
• MATEAIL：Copper FIN + Copper Base
• PROCESS: Skived FIN+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 2.1mm
• POWER DISSIPATION: 125W
核心規格
尺寸
88(L)*88(W)*25.0mm(H)
材質
Copper FIN + Copper Base
散熱功率
125W
製程
Skived FIN+Assembly
鰭片厚度
0.3mm
鰭片間距
2.1mm
CPU 鎖孔間距
78*78mm