Intel LGA1700 Series
90(L)*90(W)*25.0mm(H)
價格請洽詢
• DIMENSIONS: 90(L)*90(W)*25.0mm(H)
• CPU HOLE SPACE: 78*78mm
• MATEAIL：Copper FIN + Copper VC
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.7mm
• POWER DISSIPATION: 200W
核心規格
尺寸
90(L)*90(W)*25.0mm(H)
材質
Copper FIN + Copper VC
散熱功率
200W
製程
Stamping+Soldering+Assembly
鰭片厚度
0.3mm
鰭片間距
1.7mm
CPU 鎖孔間距
78*78mm