Intel LGA1156&2011 Series
90(L)*90(W)*64mm(H)
價格請洽詢
• DIMENSIONS: 90(L)*90(W)*64mm(H)
• MATEAIL：AL FIN+AL Base+HP3
• PROCESS: Stamping FIN+AL base +HP Soldering
• CPU SIZE: 80*80mm
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.6mm
• POWER DISSIPATION: 85 W
核心規格
尺寸
90(L)*90(W)*64mm(H)
材質
AL FIN+AL Base+HP3
散熱功率
85W
製程
Stamping FIN+AL base +HP Soldering
鰭片厚度
0.3mm
鰭片間距
1.6mm
CPU 尺寸
80*80mm