Intel LGA1156&2011 Series
106.5(L)*80(W)*27mm(H)
價格請洽詢
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• DIMENSIONS: 106.5(L)*80(W)*27mm(H)
• MATEAIL：AL FIN+AL Base
• PROCESS: Stamping FIN+AL base Soldering+FAN Assembly
• CPU SIZE: 56*94mm
• FIN THICKNESS: 0.3mm
• FIN PITCH: 1.6mm
• POWER DISSIPATION: 95W
核心規格
尺寸
106.5(L)*80(W)*27mm(H)
材質
AL FIN+AL Base
散熱功率
95W
製程
Stamping FIN+AL base Soldering+FAN Assembly
鰭片厚度
0.3mm
鰭片間距
1.6mm
CPU 尺寸
56*94mm