AMD SP3 Series
115(L)*78.0(W)*64.0mm(H)
價格請洽詢
• DIMENSIONS: 115(L)*78.0(W)*64.0mm(H)
• MATEAIL：Aluminum FIN + Copper Base+4HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 1.90mm
• POWER DISSIPATION: 300W
核心規格
尺寸
115(L)*78.0(W)*64.0mm(H)
材質
Aluminum FIN + Copper Base+4HP
散熱功率
300W
製程
Stamping+Soldering+Assembly
鰭片厚度
0.4mm
鰭片間距
1.90mm