服務器散熱模組Server Cooling Modules
AMD SP3 SeriesAMD SP3 Series
117(L)*78.9(W)*64.0mm(H)
← 同分類：服務器散熱模組← Category: Server Cooling Modules尺寸Dimensions
117(L)*78.9(W)*64.0mm(H)
材質Material
Aluminum FIN + Copper Base+4HP
製程Process
Stamping+Soldering+Assembly
鰭片厚度Fin thickness
0.4mm
鰭片間距Fin pitch
2.24mm
散熱功率Power dissipation
270W
完整規格Full specifications
規格與尺寸Specifications & dimensions
• DIMENSIONS: 117(L)*78.9(W)*64.0mm(H)
• MATEAIL：Aluminum FIN + Copper Base+4HP
• PROCESS: Stamping+Soldering+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 2.24mm
• POWER DISSIPATION: 270W
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