服務器散熱模組Server Cooling Modules
AMD SP3 SeriesAMD SP3 Series
116(L)*77.5(W)*25.5mm(H)
← 同分類：服務器散熱模組← Category: Server Cooling Modules尺寸Dimensions
116(L)*77.5(W)*25.5mm(H)
材質Material
Copper Skived FIN
製程Process
Skived FIN+Assembly
鰭片厚度Fin thickness
0.4mm
鰭片間距Fin pitch
1.9mm
散熱功率Power dissipation
180W
完整規格Full specifications
規格與尺寸Specifications & dimensions
• DIMENSIONS: 116(L)*77.5(W)*25.5mm(H)
• MATEAIL：Copper Skived FIN
• PROCESS: Skived FIN+Assembly
• FIN THICKNESS: 0.4mm
• FIN PITCH: 1.9mm
• POWER DISSIPATION: 180W
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113(L)*78(W)*155.0mm(H)
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